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MOUNTING Scheda tecnica, PDF

Kemet Corporation(1)KISTLER INSTRUMENT CORPORATION(1)KODENSHI_AUK CORP.(6)Kyocera Kinseki Corpotation(2)Laird Tech Smart Technology(8)Leach International Corporation(2)Ledil, Inc.(11)Leshan Radio Company(2)Level One(1)Linx Technologies(10)List of Unclassifed Manufacturers(16)List of Unclassifed Manufacturers(74)Lite-On Technology Corporation(9)Littelfuse(1)Lumins Inc.(18)M-System Co.,Ltd.(5)M/A-COM Technology Solutions, Inc.(8)Magnetrol International, Inc.(3)Mallory Sonalert Products Inc(4)Marl International Limited(111)Maxwell Technologies(1)Mean Well Enterprises Co., Ltd.(13)Meder Electronic(23)MERITEK ELECTRONICS CORPORATION(3)METZ CONNECT GmbH(3)Micro Commercial Components(2)Micropac Industries(1)MicroPower Direct, LLC(2)Mini-Circuits(2)Minmax Technology Co., Ltd.(1)Molex Electronics Ltd.(149)Molex Electronics Ltd.(386)Molex Electronics Ltd.(11)Molex Electronics Ltd.(103)Molex Electronics Ltd.(6)Molex Electronics Ltd.(207)Molex Electronics Ltd.(5)Molex Electronics Ltd.(42)Molex Electronics Ltd.(57)Molex Electronics Ltd.(442)MORNSUN Science& Technology Ltd.(1)Motorola, Inc(1)Murata Manufacturing Co., Ltd(1)Murata Manufacturing Co., Ltd.(6)National Instruments Corporation(1)NEC(8)Nell Semiconductor Co., Ltd(1)Neutrik AG(54)NHP Electrical Engineering Products(2)Nichicon corporation(1)NIHON DEMPA KOGYO(1)Nihon Inter Electronics Corporation(2)Ningbo songle relay co.,ltd(1)Ningbo Tianbo Ganglian Electronics Co.,Ltd(1)ODU GmbH & Co.KG(10)OEN India Limited(2)Ohmite Mfg. Co.(14)Omron Electronics LLC(37)OPTEK Technologies(1)Opto Electronics Co,. LTD(1)OSRAM GmbH(2)
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Parola chiave cercata : 'MOUNTING' - Total: 57 (1/3) Pages
Produttore elettroniciIl numero della parteScheda tecnicaSpiegazioni elettronici
Company Logo Img
Molex Electronics Ltd.
0850091081 Datasheet pdf image
155Kb/4P
2.54mm (.100) Pitch DIN 41612 M Style Male Header, Right Angle, Through Hole, 24 Circuits, without Mounting Clips, No Flux Proof
0850091005 Datasheet pdf image
151Kb/4P
2.54mm (.100) Pitch DIN 41612 M Style Male Header, Right Angle, Through Hole, 24 Circuits, without Mounting Clips, No Flux Proof
0850090062 Datasheet pdf image
149Kb/4P
2.54mm (.100) Pitch DIN 41612 M Style Male Header, Right Angle, Through Hole, 60 Circuits, without Mounting Clips, No Flux Proof
0850090086 Datasheet pdf image
165Kb/4P
2.54mm (.100) Pitch DIN 41612 M Style Male Header, Right Angle, Through Hole, 60 Circuits, without Mounting Clips, No Flux Proof
0850091093 Datasheet pdf image
154Kb/4P
2.54mm (.100) Pitch DIN 41612 M Style Male Header, Right Angle, Through Hole, 24 Circuits, without Mounting Clips, No Flux Proof
0850091110 Datasheet pdf image
149Kb/4P
2.54mm (.100) Pitch DIN 41612 M Style Male Header, Right Angle, Through Hole, 28 Circuits, with Mounting Clips, No Flux Proof
15-97-7022 Datasheet pdf image
53Kb/2P
Mini-Fit짰 TPA Header, 4.20mm Pitch, Dual Row, Vertical, with PCB Mounting Flange, 2 Circuits, Tin (Sn) Plating, without Drain Holes
15-97-7024 Datasheet pdf image
53Kb/2P
Mini-Fit짰 TPA Header, 4.20mm Pitch, Dual Row, Vertical, with PCB Mounting Flange, 2 Circuits, Gold (Au) Plating, without Drain Holes
15-97-7042 Datasheet pdf image
53Kb/2P
Mini-Fit짰 TPA Header, 4.20mm Pitch, Dual Row, Vertical, with PCB Mounting Flange, 4 Circuits, Tin (Sn) Plating, without Drain Holes
0850039054 Datasheet pdf image
100Kb/3P
2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole, 96 Circuits, with Mounting Clips, No Flux Proof, Lead free
0850039048 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch DIN 41612 C/2 Style Male Header, Right Angle, Through Hole, 48Circuits, with Mounting Clips, No Flux Proof, Lead free
0850099004 Datasheet pdf image
176Kb/4P
2.54mm (.100) Pitch DIN 41612 M Style Male Header, Right Angle, Through Hole, 24 Circuits, without Mounting Clips, No Flux Proof, Lead free
0850039055 Datasheet pdf image
201Kb/4P
2.54mm (.100) Pitch DIN 41612 C/2 Style Male Header, Right Angle, Through Hole, 48 Circuits, without Mounting Clips, No Flux Proof, Lead free
0850039050 Datasheet pdf image
97Kb/3P
2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole, 63 Circuits, No Mounting Clips, No Flux Proof, Void Pin A22, Lead free
0850039051 Datasheet pdf image
97Kb/3P
2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole, 63 Circuits, No Mounting Clips, No Flux Proof, Void Pin A13, Lead free
0850039052 Datasheet pdf image
95Kb/3P
2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole, 63 Circuits, No Mounting Clips, No Flux Proof, Void Pin C15, Lead free
0850039053 Datasheet pdf image
97Kb/3P
2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole, 63 Circuits, No Mounting Clips, No Flux Proof, Void Pin A21, Lead free
0850039023 Datasheet pdf image
75Kb/3P
2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole, 0.30關m (12關") Gold (Au) Plating, 32 Circuits, No Mounting Clips
0850032488 Datasheet pdf image
82Kb/3P
2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole, 0.60關m (24關) Selective Gold (Au) Plating, 96 Circuits, without Mounting Clips
0850037017 Datasheet pdf image
71Kb/3P
2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole, 0.60關m (24關) Selective Gold (Au) Plating, 96 Circuits, with Mounting Clips

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Cosa è MOUNTING


Nei componenti elettronici, il montaggio si riferisce al funzionamento di un componente a una scheda o altro dispositivo.

Questo è uno dei passaggi essenziali per l'installazione e la fissazione dei componenti elettronici.

I metodi di montaggio per i componenti elettronici variano a seconda del tipo e dello scopo del componente.

I metodi di montaggio rappresentativo includono il montaggio a foro e il montaggio superficiale.

Il montaggio a foro attraverso il foro è un metodo per inserire un componente in un foro nella scheda e fissare il componente saldando il foro.

Questo metodo viene utilizzato principalmente per parti o parti che devono gestire correnti elevate come alimentatori.

Il montaggio della superficie è un metodo di montaggio dei componenti di saldatura (SMD, dispositivo di montaggio superficiale) sulla superficie della scheda.

Questo metodo viene spesso utilizzato per costruire circuiti ad alta densità con piccoli componenti.

Il metodo di montaggio viene selezionato considerando le prestazioni della parte, i costi di produzione e la dimensione del prodotto.

Pertanto, il montaggio dei componenti elettronici svolge un ruolo importante nel mantenere stabilmente il funzionamento dei componenti e nel migliorare l'affidabilità dei prodotti.

*Queste informazioni sono solo a scopo informativo generale, non saremo responsabili per eventuali perdite o danni causati dalle informazioni di cui sopra.


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