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PACKAGE Scheda tecnica, PDF

P-tec Corporation(550)Pan Jit International Inc.(8)Panasonic Battery Group(8)Panasonic Semiconductor(27)PANDUIT CORP.(1)Pasternack Enterprises, Inc.(74)PCA ELECTRONICS INC.(8)Peregrine Semiconductor(2)Peregrine Semiconductor Corp.(1)Pericom Semiconductor Corporation(13)PETERMANN-TECHNIK(14)PhaseLink Corporation(1)PHOENIX CONTACT(10)Pletronics, Inc.(1)Polyfet RF Devices(1)Power-One(8)Premier Magnetics, Inc.(9)Protek Devices(9)Pulse A Technitrol Company(5)Purdy Electronics Corporation(25)Qorvo, Inc(2)QT Optoelectronics(1)Quantum Research Group(1)QUARTZCOM the communications company(14)Quectel Wireless Solutions Co., Ltd.(2)Quelighting Corp(8)Raltron Electronics Corporation(6)RCD COMPONENTS INC.(1)Recom International Power(25)Rectron Semiconductor(11)Renesas Technology Corp(20)RF Micro Devices(2)RF Monolithics, Inc(26)RFHIC(9)Rhombus Industries Inc.(20)Richtek Technology Corporation(15)RICOH electronics devices division(3)Rochester Electronics(4)Rohm(65)Roithner LaserTechnik GmbH(28)RSG Electronic Components GmbH(7)Sames(1)Samsung semiconductor(5)Sangdest Microelectronic (Nanjing) Co., Ltd(7)Sanken electric(9)SanRex Corporation(6)Sanyo Semicon Device(9)SCHOTT CORPORATION(5)Seiko Instruments Inc(26)Seme LAB(528)Semtech Corporation(2)SEMTECH ELECTRONICS LTD.(1)Sensitron(3)Sensortechnics GmbH(3)Seoul Semiconductor(44)SGX Sensortech(2)Shanghai awinic technology co.,ltd(3)SHANGHAI BELLING CO., LTD.(1)Shanghai Leiditech Electronic Technology Co., Ltd(35)Shanghai Semitech Semiconductor Co., Ltd(12)SHANTOU HUASHAN ELECTRONIC DEVICES CO.,LTD(28)Sharp Corporation(104)SHENZHEN FUMAN ELECTRONICS CO., LTD.(1)Shenzhen Huazhimei Semiconductor Co., Ltd(4)Shenzhen Luguang Electronic Technology Co., Ltd(8)SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.(3)SHENZHEN YONGERJIA INDUSTRY CO.,LTD(1)SHIKUES Electronics(14)Shindengen Electric Mfg.Co.Ltd(41)Shoulder Electronics Limited.(2)Shunye Enterprise(1)Siemens Semiconductor Group(49)Silan Microelectronics Joint-stock(4)Silicon Laboratories(3)Silonex Inc.(8)Sirectifier Global Corp.(1)SIRENZA MICRODEVICES(4)Skyworks Solutions Inc.(16)SMSC Corporation(8)Solid State Optronic(53)Solid States Devices, Inc(12)Solitron Devices Inc.(1)SPANSION(19)Stanford Microdevices(1)STANLEY ELECTRIC CO.,LTD.(14)Stanson Technology(8)StarHope(1)STATEK CORPORATION(1)STATS ChipPAC, Ltd.(1)STMicroelectronics(664)SunLED Corporation(295)Surge Components(3)Suzhou HangJing Electronic Technology Co., LTD(47)SynQor Worldwide Headquarters(3)TAI-SAW TECHNOLOGY CO., LTD.(2)TAITRON Components Incorporated(8)Taiwan Semiconductor Company, Ltd(4)Tak Cheong Electronics (Holdings) Co.,Ltd(47)TE Connectivity Ltd(5)Teccor Electronics(1)TelCom Semiconductor, Inc(1)Teledyne Technologies Incorporated(4)TEMEX(4)TEMIC Semiconductors(3)Texas Instruments(276)Texas Instruments(304)THine Electronics, Inc.(5)Thinki Semiconductor Co., Ltd.(35)Torex Semiconductor(7)Toshiba Semiconductor(21)Total Power International(37)Transcom, Inc.(2)Transko Electronics, Inc.(10)TRANSYS Electronics Limited(1)TriQuint Semiconductor(12)TT Electronics.(34)TXC Corporation.(10)Tyco Electronics(19)
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Parola chiave cercata : 'PACKAGE' - Total: 27 (1/2) Pages
Produttore elettroniciIl numero della parteScheda tecnicaSpiegazioni elettronici
Company Logo Img
Panasonic Semiconductor
JW1AFSN-DC12V-F Datasheet pdf image
116Kb/6P
Miniature package with universal Miniature package with universal
AN6914UBS Datasheet pdf image
36Kb/5P
Industrial Surface Mounting Package Comparator
AQV252G3S Datasheet pdf image
168Kb/5P
High capacity in a miniature SOP package
FK3306010L Datasheet pdf image
368Kb/6P
For switching FK350601 in SSSMini3 type package
DMC506E20R Datasheet pdf image
309Kb/3P
For high-frequency amplification DMC206E2 in SMini6 type package
DA3X108K0L Datasheet pdf image
311Kb/5P
For small current rectification DA2J108 in Mini3 type package
DB2S31400L Datasheet pdf image
328Kb/4P
For high speed switching circuits DB2J314 in SSMini2 type package
DA3X101A0L Datasheet pdf image
324Kb/5P
For high speed switching circuits DA3J101A in Mini3 type package
DB2U30800L Datasheet pdf image
335Kb/4P
For high speed switching circuits DB27308 in USSMini2 type package
AQZ264 Datasheet pdf image
648Kb/3P
High capacity up to 6A in a slim SIL package
DA3S102D0L Datasheet pdf image
335Kb/5P
For high speed switching circuits DA3J102D in SSMini3 type package
AGQ2001H Datasheet pdf image
125Kb/5P
High capacity 2 Amp, Flat and Compact package Telephone switchboard
DA3J103E0L Datasheet pdf image
312Kb/5P
For high speed switching circuits DA3X103E in SMini3 type package
FK3303010L Datasheet pdf image
282Kb/7P
Silicon N-channel MOSFET For switching FK350301 in SSSMini3 type package
AQY221R2MY Datasheet pdf image
78Kb/4P
Micro-miniature SON package Lower output capacitance and on resistance (C횞R10)
AEP25012 Datasheet pdf image
230Kb/8P
HIGH VOLTAGE AND CURRENT CUT-OFF CAPACITY IN A COMPACT PACKAGE
DRA5113Z0L Datasheet pdf image
415Kb/4P
For digital circuits Complementary to DRC5113Z DRA2113Z in SMini3 type package
FK3506010L Datasheet pdf image
366Kb/6P
Silicon N-channel MOS FET For switching FK330601 in SMini3 type package
DZ5S068D0R Datasheet pdf image
297Kb/4P
Silicon epitaxial planar type For surge absorption circuit DZ5J068D in SSMini5 type package
DMA90401 Datasheet pdf image
389Kb/4P
Silicon PNP epitaxial planar type For general amplification DMA50401 in SSMini6 type package

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Cosa è PACKAGE


Nelle parti elettroniche, il pacchetto indica una custodia o un pacchetto utilizzato per proteggere e collegare i dispositivi.

Il pacchetto svolge un ruolo importante nella protezione e nella connessione dei dispositivi.

Se il dispositivo non è adeguatamente protetto, le influenze ambientali possono danneggiare o distruggere il dispositivo.

Il pacchetto è disponibile in varie forme e dimensioni e ci sono vari tipi a seconda del tipo e dello scopo del dispositivo.

I pacchetti rappresentativi includono DIP (pacchetto Dual in-line), SOP (pacchetto piccolo outline), QFP (pacchetto quad Flat) e BGA (array di griglia a sfera).

Un tuffo è uno dei pacchetti più rappresentativi e ha due pin posizionati in linea.

Gli SOP sono pacchetti più piccoli rispetto ai crovani e hanno una forma rettangolare.

QFP è un pacchetto con pin parallelamente alla circonferenza del pacchetto e BGA è un pacchetto in cui i piccoli fori vengono perforati nella parte inferiore degli elementi e le piccole perle sono collegate a loro per collegare gli elementi.

A seconda delle caratteristiche di ciascun pacchetto, viene utilizzato per vari scopi.

Ad esempio, i calibro vengono generalmente utilizzati per circuiti integrati a bassa densità e i BGA vengono utilizzati per circuiti integrati ad alta densità.

*Queste informazioni sono solo a scopo informativo generale, non saremo responsabili per eventuali perdite o danni causati dalle informazioni di cui sopra.


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