PACKAGE Datasheet(PDF) - NR8501 - California Eastern Labs

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PACKAGE Scheda tecnica, PDF

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Parola chiave cercata : 'PACKAGE' - Total: 72 (1/4) Pages

Produttore elettronici	Il numero della parte	Scheda tecnica	Spiegazioni elettronici
California Eastern Labs	NR8501	240Kb/6P	InGaAs APD IN COAXIAL PACKAGE FOR 2.5Gb/s APPLICATIONS
	NX6510GH	946Kb/6P	LASER DIODE IN COAXIAL PACKAGE FOR FIBER OPTIC COMMUNICATIONS
	NX7304BG	96Kb/4P	LASER DIODE IN COAXIAL PACKAGE FOR FIBER OPTIC COMMUNICATIONS
	NR8360JP-BC	85Kb/2P	30 um InGaAs APD IN DIP PACKAGE FOR OTDR APPLICATION
	PS2911-1-F3-M-A	494Kb/13P	HIGH CTR, 4-PIN ULTRA SMALL PACKAGE FLAT-LEAD PHOTOCOUPLER
	PS2911	766Kb/7P	NECs HIGH CTR, 4 PIN ULTRA SMALL PACKAGE FLAT LEAD OPTOCOUPLER
	NR7500	195Kb/5P	InGaAs PIN-PD IN COAXIAL PACKAGE FOR 2.5 Gbp/s APPLICATIONS
	NX7561	185Kb/4P	NECs 1550 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
	NX7529	190Kb/4P	NECs 1550 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
	NX8304BE-CC	105Kb/5P	InGaAsP MQW-DFB LASER DIODE IN COAXIAL PACKAGE FOR FIBER OPTIC COMMUNICATIONS
	NX7661	185Kb/4P	NECs 1625 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
	NX7528	190Kb/4P	NECs 1550 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
	NX7302BA-CC	101Kb/4P	InGaAsP MQW FP LASER DIODE IN COAXIAL PACKAGE FOR 622 Mb/s APPLICATIONS
	NX8300BE-CC	125Kb/5P	InGaAsP MQW DFB LASER DIODE IN COAXIAL PACKAGE FOR 2.5 Gb/s APPLICATION
	NX7303BA	100Kb/4P	InGaAsP MQW FP LASER DIODE IN COAXIAL PACKAGE FOR 155 Mb/s APPLICATION
	NE38018	68Kb/9P	GaAs HJ-FET L TO S BAND LOW NOISE AMPLIFIER (New Plastic Package)
	NE34018	200Kb/10P	GaAs HJ-FET L TO S BAND LOW NOISE AMPLIFIER (New Plastic Package)
	NR4500BP	98Kb/3P	InGaAs APD WITH INTERNAL PREAMPLIFIER IN COAXIAL PACKAGE FOR 2.5 Gb/s APPLICATIONS
	NR8501BP	241Kb/6P	NECs 50 關m InGaAs APD IN COAXIAL PACKAGE FOR 2.5Gb/s APPLICATIONS
	NR4500BP-CC	98Kb/3P	InGaAs APD WITH INTERNAL PREAMPLIFIER IN COAXIAL PACKAGE FOR 2.5 Gb/s APPLICATIONS

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Cosa è PACKAGE

Nelle parti elettroniche, il pacchetto indica una custodia o un pacchetto utilizzato per proteggere e collegare i dispositivi.

Il pacchetto svolge un ruolo importante nella protezione e nella connessione dei dispositivi.

Se il dispositivo non è adeguatamente protetto, le influenze ambientali possono danneggiare o distruggere il dispositivo.

Il pacchetto è disponibile in varie forme e dimensioni e ci sono vari tipi a seconda del tipo e dello scopo del dispositivo.

I pacchetti rappresentativi includono DIP (pacchetto Dual in-line), SOP (pacchetto piccolo outline), QFP (pacchetto quad Flat) e BGA (array di griglia a sfera).

Un tuffo è uno dei pacchetti più rappresentativi e ha due pin posizionati in linea.

Gli SOP sono pacchetti più piccoli rispetto ai crovani e hanno una forma rettangolare.

QFP è un pacchetto con pin parallelamente alla circonferenza del pacchetto e BGA è un pacchetto in cui i piccoli fori vengono perforati nella parte inferiore degli elementi e le piccole perle sono collegate a loro per collegare gli elementi.

A seconda delle caratteristiche di ciascun pacchetto, viene utilizzato per vari scopi.

Ad esempio, i calibro vengono generalmente utilizzati per circuiti integrati a bassa densità e i BGA vengono utilizzati per circuiti integrati ad alta densità.

*Queste informazioni sono solo a scopo informativo generale, non saremo responsabili per eventuali perdite o danni causati dalle informazioni di cui sopra.

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