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PACKAGE Scheda tecnica, PDF

KEC(Korea Electronics)(406)Kemet Corporation(3)Kersemi Electronic Co., Ltd.(122)Keysight Technologies(1)Kingbor Technology Co(1)Kingston Technology Far East Co. Ltd(1)KOA Speer Electronics, Inc.(2)KODENSHI_AUK CORP.(51)KR Electronics, Inc.(5)Kyocera Kinseki Corpotation(1)Laird Tech Smart Technology(1)Lattice Semiconductor(1)Leshan Radio Company(48)LETEX TECHNOLOGY CORP.(1)LIGITEK electronics co., ltd.(1)Linear Dimensions Semiconductor(1)Linear Integrated Systems(2)Linear Technology(34)Linx Technologies(3)List of Unclassifed Manufacturers(54)List of Unclassifed Manufacturers(96)Lite-On Technology Corporation(46)Littelfuse(22)Lowpower Semiconductor inc(10)LUMEX INC.(8)Lumileds Lighting Company(36)Luminus, Inc(1)Luna Innovations Incorporated(17)LUXPIA(2)M-System Co.,Ltd.(3)M.S. Kennedy Corporation(42)M/A-COM Technology Solutions, Inc.(32)Macronix International(4)Marki Microwave(6)Marktech Corporate(5)Maxim Integrated Products(154)Mean Well Enterprises Co., Ltd.(24)Melexis Microelectronic Systems(2)Mercury United Electronics Inc(6)MIC GROUP RECTIFIERS(1)MICORO CRYSTAL SWITZERLAND(7)Micrel Semiconductor(8)Micro Commercial Components(6)Micro Electronics(9)Microchip Technology(5)Microdc power Technology Co., Ltd(10)Microdiode Electronics (Jiangsu) Co.,Ltd.(2)Micron Technology(1)Micronas(3)Micropac Industries(8)Microsemi Corporation(22)Micross Components(2)Mimix Broadband(3)Minilogic Device Corporation Limited(1)Minmax Technology Co., Ltd.(83)Mitsubishi Electric Semiconductor(389)MMD Components(48)Molex Electronics Ltd.(12)Molex Electronics Ltd.(13)Molex Electronics Ltd.(8)Molex Electronics Ltd.(28)Molex Electronics Ltd.(4)Molex Electronics Ltd.(4)Monolithic Power Systems(41)MORNSUN Science& Technology Ltd.(45)Morse Mfg. Co., Inc.(1)Mosel Vitelic, Corp(4)Mospec Semiconductor(1)Motorola, Inc(32)MPS Industries, Inc.(5)MTRONPTI(3)Murata Manufacturing Co., Ltd(3)Murata Manufacturing Co., Ltd.(8)Murata Power Solutions Inc.(3)MUSIC Semiconductors(1)Nais(Matsushita Electric Works)(4)Nanjing International Group Co(4)Nanjing Ouzhuo Technology Co., Ltd.(2)National Semiconductor (TI)(54)NEC(29)Nel Frequency Controls,inc(9)Nell Semiconductor Co., Ltd(9)New Japan Radio(3)New Jersey Semi-Conductor Products, Inc.(18)Newhaven Display International, Inc.(2)Nexperia B.V. All rights reserved(67)Nihon Inter Electronics Corporation(3)Nippon Precision Circuits Inc(2)Nisshinbo Micro Devices Inc.(2)Numonyx B.V(11)NXP Semiconductors(81)NXP Semiconductors(52)Ohmite Mfg. Co.(14)OKI electronic componets(10)Omron Electronics LLC(27)ON Semiconductor(219)OPTEK Technologies(35)OptoDiode Corp(2)Optoway Technology Inc(23)OSRAM GmbH(1013)
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Parola chiave cercata : 'PACKAGE' - Total: 22 (1/2) Pages
Produttore elettroniciIl numero della parteScheda tecnicaSpiegazioni elettronici
Company Logo Img
Littelfuse
S6015L52 Datasheet pdf image
218Kb/12P
Electrically-isolated package
P0080SA Datasheet pdf image
97Kb/1P
DO-214AA Package Symbolization
S-2025L Datasheet pdf image
218Kb/12P
RoHS Compliant, Electrically-isolated package
HE3600 Datasheet pdf image
402Kb/3P
Miniature single in-line package
HE3300 Datasheet pdf image
436Kb/3P
Miniature single in-line package
HE700 Datasheet pdf image
590Kb/3P
Miniature dual in-line package
P0080SAL Datasheet pdf image
843Kb/52P
gas plasma arresters-package dimensions/specifications
S2012DRP Datasheet pdf image
218Kb/12P
New small profile three-leaded Compak package
NGD18N45CLB Datasheet pdf image
279Kb/8P
DPAK Package Offers Smaller Footprint for Increased Board Space
SP0504BAC Datasheet pdf image
352Kb/6P
TVS Avalanche Diode Array in a Unipolar Chip Scale Package
SP0504BBCT Datasheet pdf image
172Kb/3P
SP0504BBCT - TVS Avalanche Diode Array in a Bipolar Chip Scale Package
SP0501BACT Datasheet pdf image
186Kb/3P
TVS Diode Arrays - TVS Avalanche Diode in a Chip Scale Package
SP0502AAHT Datasheet pdf image
199Kb/4P
Silicon Protection Circuits - TVS Rail Clamp Array in a Surface Mount Package
SP0504BACT Datasheet pdf image
157Kb/3P
Silicon Protection Circuits - TVS Avalanche Diode Array in a Unipolar Chip Scale Package
P1100THLRP Datasheet pdf image
448Kb/4P
This DO-41 plastic package provides a through-hole version of the SIDACtor짰 devices.
P1500MEL Datasheet pdf image
134Kb/4P
Packaged in a robust TO-218 package, the 5kA Series is ideal for use in CATV amplifiers
FPS Datasheet pdf image
2Mb/2P
The FPS Feeder Protection System monitors voltage and current to provide a comprehensive package of 17 protective functions
0460001ER Datasheet pdf image
333Kb/3P
The 460 Series Slo-Blo짰 SMF is based on Littelfuse PICO짰 fuse through-hole technology, though offered in a surface mount package.
TPSMF4L Datasheet pdf image
2Mb/6P
The TPSMF4L series of SOD-123FL small and flat lead low-profile plastic package is designed specifically to protect sensitive electronic equipment from voltage
SM7 Datasheet pdf image
780Kb/5P
The Littelfuse SM7 is a plastic-encapsulated surface mount MOV in a PPS material molded package with tin-plated terminal which is fully qualified in lead free

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Cosa è PACKAGE


Nelle parti elettroniche, il pacchetto indica una custodia o un pacchetto utilizzato per proteggere e collegare i dispositivi.

Il pacchetto svolge un ruolo importante nella protezione e nella connessione dei dispositivi.

Se il dispositivo non è adeguatamente protetto, le influenze ambientali possono danneggiare o distruggere il dispositivo.

Il pacchetto è disponibile in varie forme e dimensioni e ci sono vari tipi a seconda del tipo e dello scopo del dispositivo.

I pacchetti rappresentativi includono DIP (pacchetto Dual in-line), SOP (pacchetto piccolo outline), QFP (pacchetto quad Flat) e BGA (array di griglia a sfera).

Un tuffo è uno dei pacchetti più rappresentativi e ha due pin posizionati in linea.

Gli SOP sono pacchetti più piccoli rispetto ai crovani e hanno una forma rettangolare.

QFP è un pacchetto con pin parallelamente alla circonferenza del pacchetto e BGA è un pacchetto in cui i piccoli fori vengono perforati nella parte inferiore degli elementi e le piccole perle sono collegate a loro per collegare gli elementi.

A seconda delle caratteristiche di ciascun pacchetto, viene utilizzato per vari scopi.

Ad esempio, i calibro vengono generalmente utilizzati per circuiti integrati a bassa densità e i BGA vengono utilizzati per circuiti integrati ad alta densità.

*Queste informazioni sono solo a scopo informativo generale, non saremo responsabili per eventuali perdite o danni causati dalle informazioni di cui sopra.


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