Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |
Aries Electronics, Inc.
|
24009 |
1Mb/2P |
High-Frequency Center Probe Test Socket for Devices up to 27mm Square |
24011 |
2Mb/2P |
High-Frequency Center Probe Test Socket for Devices up to 40mm Square |
24008 |
2Mb/2P |
High-Frequency Center Probe Test Socket for Devices up to 13mm Square |
24012 |
1Mb/2P |
High-Frequency Center Probe Test Socket for Devices up to 55mm Square |
24013 |
1Mb/2P |
High-Frequency Center Probe Test Socket for Devices up to 6.5mm Square |
24009-APP |
2Mb/2P |
High-Frequency Center Probe Test Socket with Adj. Pressure Pad for Devices up to 27mm Sq |
23026 |
803Kb/1P |
Hi-Temp 200째C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices |
23026HT |
844Kb/1P |
High-Temp 200째C Test & Burn-In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices |
24005 |
1Mb/2P |
Long-Life Hi-Frequency Sockets for BGA, LGA, QFN, MLCC, 關BGA and Bumped Die Devices |