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MOUNT Scheda tecnica, PDF

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Parola chiave cercata : 'MOUNT' - Total: 14 (1/1) Pages
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Cosa è MOUNT


Nei componenti elettronici, il Monte si riferisce alle parti di montaggio a un substrato o PCB (circuito stampato).

Quando si monta le parti, utilizzare i pin della parte per abbinare il foro del PCB o per saldare il cuscinetto di saldatura sul fondo della parte.

In generale, il metodo di montaggio dei componenti elettronici può essere diviso in due categorie:

Monte a foro attraverso

Il supporto a foro attraverso il foro è un metodo per collegare un foro in un PCB e collegare parti.

Il metodo di montaggio a foro è disponibile solo in una posizione specifica del PCB e se il PCB è spesso, le parti hanno lo svantaggio di occupare lo spazio dall'altro lato del PCB.

Surface Mount Technology (SMT)

La tecnologia del montaggio superficiale è un metodo di montaggio sulla superficie del PCB.

Il metodo SMT può montare le parti ovunque sul PCB e occupano meno spazio rispetto al metodo di montaggio del buco del buco, che può ridurre le dimensioni del prodotto elettronico.

Il metodo SMT è un metodo di saldatura al pad di saldatura, quindi non è assunto dallo spessore del PCB e può anche configurare circuiti ad alta densità.

Il metodo SMT è un metodo standard utilizzato di recente nella maggior parte dei componenti elettronici.

*Queste informazioni sono solo a scopo informativo generale, non saremo responsabili per eventuali perdite o danni causati dalle informazioni di cui sopra.


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