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PACKAGE Scheda tecnica, PDF

KEC(Korea Electronics)(406)Kemet Corporation(3)Kersemi Electronic Co., Ltd.(122)Keysight Technologies(1)Kingbor Technology Co(1)Kingston Technology Far East Co. Ltd(1)KOA Speer Electronics, Inc.(2)KODENSHI_AUK CORP.(51)KR Electronics, Inc.(5)Kyocera Kinseki Corpotation(1)Laird Tech Smart Technology(1)Lattice Semiconductor(1)Leshan Radio Company(48)LETEX TECHNOLOGY CORP.(1)LIGITEK electronics co., ltd.(1)Linear Dimensions Semiconductor(1)Linear Integrated Systems(2)Linear Technology(34)Linx Technologies(3)List of Unclassifed Manufacturers(54)List of Unclassifed Manufacturers(96)Lite-On Technology Corporation(46)Littelfuse(22)Lowpower Semiconductor inc(10)LUMEX INC.(8)Lumileds Lighting Company(36)Luminus, Inc(1)Luna Innovations Incorporated(17)LUXPIA(2)M-System Co.,Ltd.(3)M.S. Kennedy Corporation(42)M/A-COM Technology Solutions, Inc.(32)Macronix International(4)Marki Microwave(6)Marktech Corporate(5)Maxim Integrated Products(154)Mean Well Enterprises Co., Ltd.(24)Melexis Microelectronic Systems(2)Mercury United Electronics Inc(6)MIC GROUP RECTIFIERS(1)MICORO CRYSTAL SWITZERLAND(7)Micrel Semiconductor(8)Micro Commercial Components(6)Micro Electronics(9)Microchip Technology(5)Microdc power Technology Co., Ltd(10)Microdiode Electronics (Jiangsu) Co.,Ltd.(2)Micron Technology(1)Micronas(3)Micropac Industries(8)Microsemi Corporation(22)Micross Components(2)Mimix Broadband(3)Minilogic Device Corporation Limited(1)Minmax Technology Co., Ltd.(83)Mitsubishi Electric Semiconductor(389)MMD Components(48)Molex Electronics Ltd.(12)Molex Electronics Ltd.(13)Molex Electronics Ltd.(8)Molex Electronics Ltd.(28)Molex Electronics Ltd.(4)Molex Electronics Ltd.(4)Monolithic Power Systems(41)MORNSUN Science& Technology Ltd.(45)Morse Mfg. Co., Inc.(1)Mosel Vitelic, Corp(4)Mospec Semiconductor(1)Motorola, Inc(32)MPS Industries, Inc.(5)MTRONPTI(3)Murata Manufacturing Co., Ltd(3)Murata Manufacturing Co., Ltd.(8)Murata Power Solutions Inc.(3)MUSIC Semiconductors(1)Nais(Matsushita Electric Works)(4)Nanjing International Group Co(4)Nanjing Ouzhuo Technology Co., Ltd.(2)National Semiconductor (TI)(54)NEC(29)Nel Frequency Controls,inc(9)Nell Semiconductor Co., Ltd(9)New Japan Radio(3)New Jersey Semi-Conductor Products, Inc.(18)Newhaven Display International, Inc.(2)Nexperia B.V. All rights reserved(67)Nihon Inter Electronics Corporation(3)Nippon Precision Circuits Inc(2)Nisshinbo Micro Devices Inc.(2)Numonyx B.V(11)NXP Semiconductors(81)NXP Semiconductors(52)Ohmite Mfg. Co.(14)OKI electronic componets(10)Omron Electronics LLC(27)ON Semiconductor(219)OPTEK Technologies(35)OptoDiode Corp(2)Optoway Technology Inc(23)OSRAM GmbH(1013)
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Parola chiave cercata : 'PACKAGE' - Total: 219 (1/11) Pages
Produttore elettroniciIl numero della parteScheda tecnicaSpiegazioni elettronici
Company Logo Img
ON Semiconductor
ULPMC10 Datasheet pdf image
159Kb/19P
Struix System-in-Package
July, 2015 ??Rev. 4
506AL Datasheet pdf image
34Kb/2P
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
December, 2005 ??Rev. 01A
369A-13 Datasheet pdf image
21Kb/1P
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
August, 2001 ??Rev. 13AB
RSL10SIP Datasheet pdf image
1Mb/20P
Bluetooth 5 System-in-Package (SiP)
May, 2020 ??Rev. 1
1PMT50AT1 Datasheet pdf image
57Kb/6P
Zener Transient Voltage Suppressor POWERMITE Package
April, 2004 ??Rev. 7
1PMT5.0AT1 Datasheet pdf image
65Kb/6P
Zener Transient Voltage Suppressor POWERMITE Package
July, 2005 ??Rev. 9
MBRS1100T3 Datasheet pdf image
49Kb/4P
Schottky Power Rectifier Surface Mount Power Package
March, 2007 ??Rev. 9
1PMT5920B Datasheet pdf image
62Kb/8P
3.2 Watt Plastic Surface Mount POWERMITE Package
July, 2003 ??Rev. 0
MJF47 Datasheet pdf image
135Kb/6P
High Voltage Power Transistor Isolated Package Applications
April, 2006 ??Rev. 5
MURD530 Datasheet pdf image
107Kb/5P
SWITCHMODE Power Rectifier DPAK Surface Mount Package
November, 2008 ??Rev. 1
PACDN1408CG Datasheet pdf image
112Kb/5P
ESD Protection Arrays in Chip Scale Package
October, 2011 ??Rev. 4
1PMT5920B Datasheet pdf image
62Kb/6P
3.2 Watt Plastic Surface Mount POWERMITE Package
July, 2005 ??Rev. 3
EMI2180MTTBG Datasheet pdf image
253Kb/7P
Single Integrated Package for Common Mode Filter
November, 2012 ??Rev. 0
SURD8320T4G Datasheet pdf image
136Kb/4P
SWITCHMODE Power Rectifier DPAK Surface Mount Package
January, 2012 ??Rev. 7
MBRS130LT3G Datasheet pdf image
278Kb/6P
Schottky Power Rectifier Surface Mount Power Package
December, 2019 - Rev. 11
CM1242-07CP Datasheet pdf image
152Kb/5P
1-Channel Ultra Small 0201 Package ESD Protection
July, 2012 ??Rev. 5
NTR1P02T1G Datasheet pdf image
135Kb/5P
??0 V, ?? A, P?묬hannel SOT??3 Package
October, 2011 ??Rev. 6
NCT475 Datasheet pdf image
171Kb/13P
Industry Standard Digital Temperature Sensor in CSP Package
June, 2015 ??Rev. 0
MBRB2535CTL Datasheet pdf image
61Kb/5P
SWITCHMODE??Power Rectifier D2PAK Surface Mount Power Package
January, 2007 ??Rev. 6
OPAMP3EVB Datasheet pdf image
129Kb/12P
Op Amp Evaluation Board Manual TSSOP-16 Package
September, 2005 ??Rev. 0

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Cosa è PACKAGE


Nelle parti elettroniche, il pacchetto indica una custodia o un pacchetto utilizzato per proteggere e collegare i dispositivi.

Il pacchetto svolge un ruolo importante nella protezione e nella connessione dei dispositivi.

Se il dispositivo non è adeguatamente protetto, le influenze ambientali possono danneggiare o distruggere il dispositivo.

Il pacchetto è disponibile in varie forme e dimensioni e ci sono vari tipi a seconda del tipo e dello scopo del dispositivo.

I pacchetti rappresentativi includono DIP (pacchetto Dual in-line), SOP (pacchetto piccolo outline), QFP (pacchetto quad Flat) e BGA (array di griglia a sfera).

Un tuffo è uno dei pacchetti più rappresentativi e ha due pin posizionati in linea.

Gli SOP sono pacchetti più piccoli rispetto ai crovani e hanno una forma rettangolare.

QFP è un pacchetto con pin parallelamente alla circonferenza del pacchetto e BGA è un pacchetto in cui i piccoli fori vengono perforati nella parte inferiore degli elementi e le piccole perle sono collegate a loro per collegare gli elementi.

A seconda delle caratteristiche di ciascun pacchetto, viene utilizzato per vari scopi.

Ad esempio, i calibro vengono generalmente utilizzati per circuiti integrati a bassa densità e i BGA vengono utilizzati per circuiti integrati ad alta densità.

*Queste informazioni sono solo a scopo informativo generale, non saremo responsabili per eventuali perdite o danni causati dalle informazioni di cui sopra.


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