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PACKAGE Scheda tecnica, PDF

ALL A-BRIGHT Inc(45)ABLIC Inc.(10)Abracon Corporation(23)ACCUTEK MICROCIRCUIT CORPORATION(8)ACE Technology Co., LTD.(1)Actel Corporation(3)Acutechnology Semiconductor(10)Advanced Analog Technology, Inc.(2)Advanced Analogic Technologies(8)Advanced Crystal Technology(10)Advanced Micro Devices(14)Advanced Photonix, Inc.(24)Advanced Power Electronics Corp.(112)Advanced Power Technology(2)Advanced Semiconductor(4)Advanced Technical Materials Inc.(1)Advanced Thermal Solutions, Inc.(14)Advanced XTAL Products(87)Advantech Co., Ltd.(5)Aeroflex Circuit Technology(3)Agilent(Hewlett-Packard)(34)AIMTEC(1)AiT Semiconductor Inc.(3)All Sensors Corporation(6)Allegro MicroSystems(19)Allen-Bradley(1)Alliance Semiconductor Corporation(17)Allied Components International(3)Alpha & Omega Semiconductors(89)ALPS ELECTRIC CO.,LTD.(2)Altera Corporation(5)AMAZING Microelectronic Corp.(37)American Accurate Components, Inc.(5)American Microsemiconductor(52)AMIC Technology(4)Amkor Technology(21)Amphenol Corporation(4)Analog Devices(82)Analog Intergrations Corporation(1)Analog Microelectronics(1)Anaren Microwave(5)Anpec Electronics Coropration(2)Anshan Suly Electronics(1)API Delevan(3)Aries Electronics, Inc.(4)Asahi Kasei Microsystems(35)Astec America, Inc(2)ATMEL Corporation(3)AVAGO TECHNOLOGIES LIMITED(127)AVG Semiconductors(HITEK)(1)Avic Technology(1)AVX Corporation(1)BCM Advanced Research.(1)Bel Fuse Inc.(17)BetLux Electronics(15)Bi technologies(3)Bivar, Inc.(193)Bolymin, Inc(73)Bothhand USA, LP.(6)Bourns Electronic Solutions(9)BRIGHT LED ELECTRONICS CORP(41)Broadcom Corporation.(76)Bruckewell Technology LTD(2)Bud Industries, Inc.(1)C&D Technologies(1)C&K Components(3)California Eastern Labs(72)California Micro Devices Corp(9)CAMBION Electronic Components(4)Catalyst Semiconductor(3)Central Semiconductor Corp(39)Chicago Miniature Lamp,inc(9)CITIZEN ELECTRONICS CO., LTD.(98)Clairex Technologies, Inc(11)CML Microcircuits(3)Compensated Deuices Incorporated(4)Connor-Winfield Corporation(1)Continental Device India Limited(56)COSMO Electronics Corporation(23)Cree, Inc(1)Crydom Inc.,(5)Crystek Corporation(1)CTS Corporation(5)CUI INC(3)Cypress Semiconductor(4)Cystech Electonics Corp.(3)DAICO Industries, Inc.(1)Dallas Semiconductor(4)Datatronic Distribution, Inc.(3)DB Lectro Inc(14)Delta Electronics, Inc.(65)Dialight Corporation(13)Dialog Semiconductor(2)DinTek Semiconductor Co,.Ltd(1)Diodes Incorporated(37)DIYI Electronic Technology Co., Ltd.(2)E&E Magnetic Products Limited(3)E-SWITCH(45)E-Tech Electronics LTD(3)Ecliptek Corporation(1)ECS, Inc.(4)EHAOAN.(40)Elantec Semiconductor(1)Elite Enterprises (H.K.) Co., Ltd.(1)ELM Electronics(2)ELM Technology Corporation(34)Emerson Network Power(4)Enpirion, Inc.(1)Eon Silicon Solution Inc.(3)EPCOS(2)Epson Company(2)ESPRESSIF SYSTEMS (SHANGHAI) CO., LTD.(1)ETA SOLUTIONS CO. LIMITED(6)EUROQUARTZ limited(9)Eutech Microelectronics Inc(6)Everlight Electronics Co., Ltd(389)Exar Corporation(2)
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Parola chiave cercata : 'PACKAGE' - Total: 104 (1/6) Pages
Produttore elettroniciIl numero della parteScheda tecnicaSpiegazioni elettronici
Company Logo Img
Sharp Corporation
PQ1MX55M2SPQ Datasheet pdf image
150Kb/5P
Compact surface mount package (4.5x4.3x1.5mm)
PQ1CF2 Datasheet pdf image
29Kb/3P
TO-220 Package Chopper Regulator
PQ1CF1 Datasheet pdf image
28Kb/3P
TO-220 Package Chopper Regulator
PC411L0YIP0F Datasheet pdf image
205Kb/13P
High Speed 15Mb/s, High CMR Mini-flat Package OPIC Mini-flat Package ?뾑PIC
PC357N Datasheet pdf image
194Kb/14P
Mini-flat Package, General Purpose Photocoupler
PC357NJ0000F Datasheet pdf image
230Kb/14P
Mini-flat Package, General Purpose Photocoupler
PC357N4TJ00F Datasheet pdf image
416Kb/14P
Mini-flat Package, General Purpose Photocoupler
PC355NT Datasheet pdf image
54Kb/5P
Mini-Flat Package, High Sensitivity Photocoupler
PC357N4J000F Datasheet pdf image
204Kb/14P
Mini-flat Package, General Purpose Photocoupler
PC357N2TJ00F Datasheet pdf image
204Kb/14P
Mini-flat Package, General Purpose Photocoupler
PC357N2J000F Datasheet pdf image
204Kb/14P
Mini-flat Package,General Purpose Photocoupler
PC352NJ0000F Datasheet pdf image
238Kb/14P
Mini-flat Package, High CMR Photocoupler
PC357N2 Datasheet pdf image
194Kb/14P
Mini-flat Package, General Purpose Photocoupler
PC354NJ0000F Datasheet pdf image
232Kb/14P
Mini-flat Package, AC Input Photocoupler
PC357N1J000F Datasheet pdf image
204Kb/14P
Mini-flat Package, General Purpose Photocoupler
PC354N1TJ00F Datasheet pdf image
206Kb/14P
Mini-flat Package, AC Input Photocoupler
BS115 Datasheet pdf image
90Kb/2P
CAN PACKAGE PHOTODIODE FOR VISIBLE LIGHT
PC354NTJ000F Datasheet pdf image
206Kb/14P
Mini-flat Package, AC Input Photocoupler
PC357N Datasheet pdf image
219Kb/14P
Mini-flat Package General Purpose Photocoupler
PC357N9J000F Datasheet pdf image
204Kb/14P
Mini-flat Package, General Purpose Photocoupler

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Cosa è PACKAGE


Nelle parti elettroniche, il pacchetto indica una custodia o un pacchetto utilizzato per proteggere e collegare i dispositivi.

Il pacchetto svolge un ruolo importante nella protezione e nella connessione dei dispositivi.

Se il dispositivo non è adeguatamente protetto, le influenze ambientali possono danneggiare o distruggere il dispositivo.

Il pacchetto è disponibile in varie forme e dimensioni e ci sono vari tipi a seconda del tipo e dello scopo del dispositivo.

I pacchetti rappresentativi includono DIP (pacchetto Dual in-line), SOP (pacchetto piccolo outline), QFP (pacchetto quad Flat) e BGA (array di griglia a sfera).

Un tuffo è uno dei pacchetti più rappresentativi e ha due pin posizionati in linea.

Gli SOP sono pacchetti più piccoli rispetto ai crovani e hanno una forma rettangolare.

QFP è un pacchetto con pin parallelamente alla circonferenza del pacchetto e BGA è un pacchetto in cui i piccoli fori vengono perforati nella parte inferiore degli elementi e le piccole perle sono collegate a loro per collegare gli elementi.

A seconda delle caratteristiche di ciascun pacchetto, viene utilizzato per vari scopi.

Ad esempio, i calibro vengono generalmente utilizzati per circuiti integrati a bassa densità e i BGA vengono utilizzati per circuiti integrati ad alta densità.

*Queste informazioni sono solo a scopo informativo generale, non saremo responsabili per eventuali perdite o danni causati dalle informazioni di cui sopra.


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