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PACKAGE Scheda tecnica, PDF

ALL A-BRIGHT Inc(45)ABLIC Inc.(10)Abracon Corporation(23)ACCUTEK MICROCIRCUIT CORPORATION(8)ACE Technology Co., LTD.(1)Actel Corporation(3)Acutechnology Semiconductor(10)Advanced Analog Technology, Inc.(2)Advanced Analogic Technologies(8)Advanced Crystal Technology(10)Advanced Micro Devices(14)Advanced Photonix, Inc.(24)Advanced Power Electronics Corp.(112)Advanced Power Technology(2)Advanced Semiconductor(4)Advanced Technical Materials Inc.(1)Advanced Thermal Solutions, Inc.(14)Advanced XTAL Products(87)Advantech Co., Ltd.(5)Aeroflex Circuit Technology(3)Agilent(Hewlett-Packard)(34)AIMTEC(1)AiT Semiconductor Inc.(3)All Sensors Corporation(6)Allegro MicroSystems(19)Allen-Bradley(1)Alliance Semiconductor Corporation(17)Allied Components International(3)Alpha & Omega Semiconductors(89)ALPS ELECTRIC CO.,LTD.(2)Altera Corporation(5)AMAZING Microelectronic Corp.(37)American Accurate Components, Inc.(5)American Microsemiconductor(52)AMIC Technology(4)Amkor Technology(21)Amphenol Corporation(4)Analog Devices(82)Analog Intergrations Corporation(1)Analog Microelectronics(1)Anaren Microwave(5)Anpec Electronics Coropration(2)Anshan Suly Electronics(1)API Delevan(3)Aries Electronics, Inc.(4)Asahi Kasei Microsystems(35)Astec America, Inc(2)ATMEL Corporation(3)AVAGO TECHNOLOGIES LIMITED(127)AVG Semiconductors(HITEK)(1)Avic Technology(1)AVX Corporation(1)BCM Advanced Research.(1)Bel Fuse Inc.(17)BetLux Electronics(15)Bi technologies(3)Bivar, Inc.(193)Bolymin, Inc(73)Bothhand USA, LP.(6)Bourns Electronic Solutions(9)BRIGHT LED ELECTRONICS CORP(41)Broadcom Corporation.(76)Bruckewell Technology LTD(2)Bud Industries, Inc.(1)C&D Technologies(1)C&K Components(3)California Eastern Labs(72)California Micro Devices Corp(9)CAMBION Electronic Components(4)Catalyst Semiconductor(3)Central Semiconductor Corp(39)Chicago Miniature Lamp,inc(9)CITIZEN ELECTRONICS CO., LTD.(98)Clairex Technologies, Inc(11)CML Microcircuits(3)Compensated Deuices Incorporated(4)Connor-Winfield Corporation(1)Continental Device India Limited(56)COSMO Electronics Corporation(23)Cree, Inc(1)Crydom Inc.,(5)Crystek Corporation(1)CTS Corporation(5)CUI INC(3)Cypress Semiconductor(4)Cystech Electonics Corp.(3)DAICO Industries, Inc.(1)Dallas Semiconductor(4)Datatronic Distribution, Inc.(3)DB Lectro Inc(14)Delta Electronics, Inc.(65)Dialight Corporation(13)Dialog Semiconductor(2)DinTek Semiconductor Co,.Ltd(1)Diodes Incorporated(37)DIYI Electronic Technology Co., Ltd.(2)E&E Magnetic Products Limited(3)E-SWITCH(45)E-Tech Electronics LTD(3)Ecliptek Corporation(1)ECS, Inc.(4)EHAOAN.(40)Elantec Semiconductor(1)Elite Enterprises (H.K.) Co., Ltd.(1)ELM Electronics(2)ELM Technology Corporation(34)Emerson Network Power(4)Enpirion, Inc.(1)Eon Silicon Solution Inc.(3)EPCOS(2)Epson Company(2)ESPRESSIF SYSTEMS (SHANGHAI) CO., LTD.(1)ETA SOLUTIONS CO. LIMITED(6)EUROQUARTZ limited(9)Eutech Microelectronics Inc(6)Everlight Electronics Co., Ltd(389)Exar Corporation(2)
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Parola chiave cercata : 'PACKAGE' - Total: 39 (1/2) Pages
Produttore elettroniciIl numero della parteScheda tecnicaSpiegazioni elettronici
Company Logo Img
Central Semiconductor C... 		PBCBRLD1_1509 Datasheet pdf image
1Mb/2P		 Low profile package
CTLDM3590_CTLDM7590 Datasheet pdf image
1Mb/2P		 MOSFETs in the TLM3D6D8 package
CXDM3069N_4060N_6053N Datasheet pdf image
1Mb/2P		 MOSFETs in the SOT-89 package
CWDM305P Datasheet pdf image
1Mb/2P		 30V, MOSFETs in the SOIC-8 package
CMLDM3737_5757 Datasheet pdf image
1Mb/2P		 Dual, Complementary MOSFETs in miniature SOT-563 package
CMSH2-40FL Datasheet pdf image
1Mb/2P		 2.0A, 40V Schottky Rectifier in the SMAFL package
CMSH3-40FL Datasheet pdf image
1Mb/2P		 3.0A, 40V Schottky Rectifier in the SMBFL package
CMLDM3737_5757 Datasheet pdf image
1Mb/2P		 Dual, Complementary MOSFETs in miniature SOT-563 package
CTLTVS12 Datasheet pdf image
1Mb/2P		 Transient Voltage Suppressor in the miniature TLM2D3D6 package
CMPDM7002AE Datasheet pdf image
1Mb/2P		 60V, 300mA N-Channel MOSFET in SOT-23 package
CMNDM7001_8001 Datasheet pdf image
1Mb/2P		 20V, 100mA, MOSFETs in the miniature SOT-953 package
CMKT3920 Datasheet pdf image
1Mb/2P		 50V, 200mA Dual, NPN Transistors in SOT-363 package
CMUSHW2-4L Datasheet pdf image
1Mb/2P		 Low VF Schottky Diode in the SOT-523W package
CTLSH10-45M364 Datasheet pdf image
1Mb/2P		 10A, 45V Low VF Schottky Rectifier in the TLM364 package
CMSH1-40HE_SERIES Datasheet pdf image
1Mb/2P		 1.0A, 40V thru 200V Schottky Rectifiers in the SMA package
CMUDM7005_8005 Datasheet pdf image
1Mb/2P		 20V, 650mA, Complementary MOSFETs in the miniature SOT-523 package
CMO5V0LC Datasheet pdf image
1Mb/2P		 5.0V, ESD Transient Voltage Suppressor in the SOD-523 package
CFD4448 Datasheet pdf image
1Mb/2P		 120V, 250mA Switching Diode in ultra miniature SOD-882L package
CTLSH01-30 Datasheet pdf image
1Mb/2P		 30V, 100mA Schottky Diode in the ultra miniature TLM2D3D6 package
CTLSH4-200M364 Datasheet pdf image
1Mb/2P		 4.0A, 200V Low VF Schottky Rectifier in the TLM364 package

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Cosa è PACKAGE

Nelle parti elettroniche, il pacchetto indica una custodia o un pacchetto utilizzato per proteggere e collegare i dispositivi.

Il pacchetto svolge un ruolo importante nella protezione e nella connessione dei dispositivi.

Se il dispositivo non è adeguatamente protetto, le influenze ambientali possono danneggiare o distruggere il dispositivo.

Il pacchetto è disponibile in varie forme e dimensioni e ci sono vari tipi a seconda del tipo e dello scopo del dispositivo.

I pacchetti rappresentativi includono DIP (pacchetto Dual in-line), SOP (pacchetto piccolo outline), QFP (pacchetto quad Flat) e BGA (array di griglia a sfera).

Un tuffo è uno dei pacchetti più rappresentativi e ha due pin posizionati in linea.

Gli SOP sono pacchetti più piccoli rispetto ai crovani e hanno una forma rettangolare.

QFP è un pacchetto con pin parallelamente alla circonferenza del pacchetto e BGA è un pacchetto in cui i piccoli fori vengono perforati nella parte inferiore degli elementi e le piccole perle sono collegate a loro per collegare gli elementi.

A seconda delle caratteristiche di ciascun pacchetto, viene utilizzato per vari scopi.

Ad esempio, i calibro vengono generalmente utilizzati per circuiti integrati a bassa densità e i BGA vengono utilizzati per circuiti integrati ad alta densità.

*Queste informazioni sono solo a scopo informativo generale, non saremo responsabili per eventuali perdite o danni causati dalle informazioni di cui sopra.


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